photolithography (Also photolithographies) : Related Words Words similar in meaning to photolithography
- photolithography«
- photo-«
- wafer«
- printing«
- photoresist«
- lithography«
- plate«
- excimer laser lithography«
- photozincography«
- resist«
- minimum feature size«
- photomask«
- wavelength«
- photolithographic«
- excimer laser«
- photolithographer«
- photolithograph«
- mask«
- light«
- immersion lithography«
- photolith«
- wafer surface«
- photographic«
- microcircuit«
- proximity lithography«
- lithophotography«
- lithographic«
- pattern«
- entire wafer«
- substrate«
- extreme ultraviolet lithography«
- resolution«
- layer«
- image«
- numerical aperture«
- projection system«
- water repellent layer«
- semiconductor industry«
- exposure«
- positive photoresist«
- computational lithography«
- mercury arc lamp«
- lithography tool«
- gap distance«
- laser«
- thickness«
- bitumen«
- nanometer«
- lens«
- process«
- exposure system«
- optical lithography«
- liquid«
- nanoimprint lithography«
- contact printing«
- spin coating«
- moore ’s law«
- contact«
- electron laser«
- developer«
- coefficient«
- stepper«
- depth«
- silicon dioxide«
- light intensity«
- data file«
- refractive index«
- micrometer«
- scanner«
- frequency«
- aspect ratio«
- chemistry«
- transistor«
- material«
- wet etch process«
- uv excimer laser«
- target design rule«
- sub-193nm wavelength«
- stepper/scanner system«
- spin coating process result«
- simplest exposure system«
- significant undercutting«
- root word photo«
- robotic wafer track system«
- resolution lithographic step«
- residue.by rex photography«
- rca clean procedure«
- raster scan manner«
- purge equipment«
- proximity printer«
- proximity mask«
- projection exposure system«
- platemaking process«
- photoresist structure«
- photoresist removal«
- photoresist application«
- photolithographic cycle«
- peb time«
- oskar süß«
- modern cmos wafer«
- modern cleanrooms«
- mid-1990s cymer inc.«
- maskless lithography project«
- louis plambeck jr.«
- lithography equipment manufacturer«
- liquid immersion technique«
- limestone printing plate«
- lambda physik«
- index immersion lithography«
- illuminated mask«
- hg lamp«
- gigaphoton inc.«
- future ion implantation«
- f2 excimer laser«
- excimer laser source«
- excimer laser lithography machine«
- excimer laser light source«
- excess photoresist solvent«
- euv energy«
- etching resist«
- entire surface cost«
- effective na«
- dycryl polymeric letterpress plate«
- defectivity anisotropic dry«
- deep ultraviolet excimer laser«
- current exposure system«
- constructive interference pattern«
- computerized data file«
- clean operating condition«
- chemical lithography«
- bead removal«
- aqueous developer«
- antireflective material«
- amazing optical feat«
- alternative lightsource«
- uniformity«
- plasma«
- etching«
- xenon plasma«
- wet chemical treatment«
- usual air gap«
- typical aspect ratio«
- superb resistance«
- steady dc current«
- projection mask«
- precise beam«
- permanent photoetching«
- mosfet fabrication«
- microelectronics production«
- ion projection lithography«
- inorganic contamination«
- hard bake«
- halide gas«
- free developer«
- dominant lithography technology«
- dense feature«
- conventional uv«
- collapse effect«
- coherent extreme uv«
- beam writer«
- art photolithography tool«
- optic«
- wide angle image«
- uv lithography«
- uniform thin layer«
- specific gas mixture«
- projection lithography«
- polymer soluble«
- peb.«
- nicephore niepce«
- minimum feature«
- macroscale process«
- lithography system«
- laser writer«
- kanti jain«
- k1 factor«
- eximer laser«
- dry etching technique«
- denser chip«
- deep ultraviolet lithography«
- basic developer«
- topography«
- quality beam«
- photoresist layer«
- mechanical modelling«
- magnetolithography«
- lumonics«
- ibm site«
- extreme uv«
- exposure bake«
- euv source«
- chemical mechanical polishing«
- edge«
- xaser«
- wet chemical etching«
- wafer foundry«
- photo resist«
- phenomenal advance«
- negative photoresist«
- material beneath«
- krf laser«
- arbitrary wavelength«
- focus«
- unexposed region«
- sensitive alternative«
- precision version«
- photoresist pattern«
- diazonaphthoquinone«
- bis(trimethylsilyl)amine«
- lamp«
- tmah«
- optical mask«
- nanochannel glass material«
- exposure pattern«
- etch process«
- ashing«
- single spectral line«
- hexamethyldisilazane«
- euv light«
- contact printer«
- argon fluoride laser«
- quartz substrate«
- prototyping process«
- faster chip«
- exact control«
- undesirable contaminant«
- inexpensive hardware«
- deionised water«
- die«
- print feature«
- pen nanolithography«
- natural asphalt«
- multiple patterning«
- krypton fluoride laser«
- complete pattern«
- adhesion promoter«
- photolithographic process«
- deep ultraviolet«
- tetramethylammonium hydroxide«
- multiple laser«
- illumination light«
- uniform light«
- flat substrate«
- dry etching«
- chip manufacturing«
- absorption characteristic«
- tool technology«
- it main disadvantage«
- familiar technique«
- temperature sufficient«
- graphy«
- final thickness«
- method«
- ray lithography«
- ar2«
- technological perspective«
- feature«
- soft lithography«
- strong peak«
- sensitive chemical«
- micrometres thick«
- photographic developer«
- i.b.m.«
- single iteration«
- flat layer«
- plasma etching«
- lithographic printing«
- duv«
- dominant supplier«
- suitable solvent«
- opposite manner«
- liquid solvent«
- gate oxide«
- beam«
- size«
- photomasks«
- peb«
- ray device«
- special solution«
- mirror«
- experimental tool«
- hotplate«
- wave phenomenon«
- primary manufacturer«
- euv«
- discharge lamp«
- ultraviolet range«
- substrate material«
- semiconductor fabrication«
- coherent light«
- litho«
- advanced machine«
- feature size«
- material change«
- electron beam lithography«
- spot size«
- critical dimension«
- modern process«
- commercial process«
- other solution«
- alternative type«
- uppermost layer«
- stereolithography«
- microfabrication«
- pioneering development«
- basic procedure«
- optical resolution«
- advanced treatment«
- viscous force«
- printing method«
- liquid solution«
- ray spectrum«
- gas«
- threshold voltage«
- coherent«
- acid bath«
- chemical change«
- scale integration«
- light system«
- procedure«
- subsequent stage«
- intense light«
- thin coating«
- hot plate«
- trichloroethylene«
- metal«
- dioxide«
- vacuum system«
- printing plate«
- trivial matter«
- reticle«
- photography«
- nanometre«
- photographic process«
- microelectromechanical system«
- strong incentive«
- production environment«
- economic consideration«
- design method«
- dimensional shape«
- bottom layer«
- commercial life«
- band gap«
- primary tool«
- temperature«
- vlsi«
- advance«
- vacuum pump«
- xe«
- synchrotron«
- chemical treatment«
- incident light«
- volume production«
- sodium ion«
- free electron«
- naoh«
- noble gas«
- development«
- closest rival«
- strong acid«
- line«
- energy loss«
- spectral line«
- challenge«
- crucial factor«
- chemical agent«
- new trick«
- surface layer«
- experimental method«
- technique«
- major milestone«
- shape«
- xenon«
- significant challenge«
- modern technique«
- micrometres«
- sodium hydroxide«
- geometric pattern«
- top layer«
- stone«
- surface«
- diffraction«
- acetone«
- greek origin«
- laser beam«
- essential role«
- thin film«
- modern system«
- series«
- hydrogen peroxide«
- denser«
- thick layer«
- ultraviolet light«
- throughput«
- methanol«
- circuit board«
- chromium«
- judea«
- broad spectrum«
- introduction«
- adhesion«
- square root«
- car«
- fundamental principle«
- current research«
- uv«
- electric field«
- stripper«
- primary reason«
- lifting«
- critical role«
- ability«
- manner similar«
- polygon«
- commercialization«
- evaporation«
- chrome«
- spinner«
- direct contact«
- photon«
- lower cost«
- solvent«
- volt«
- silicon«
- coating«
- bump«
- sodium«
- dip«
- decade«
- dy«
- fabrication«
- low cost«
- minute«
- wax«
- common type«
- contamination«
- shortcoming«
- offset lithography«
- chromolithography«
- lithographer«
- lithograph machine«
- lithograph«
- 193nm lithography«
- 193nm wavelength«
- 65nm feature size node«
- 193nm excimer laser lithography technology«
- 193nm arf excimer laser«
- 157nm technology«
- 1-methyl-2-pyrrolidone«
- 157nm wavelength«
- 50-year history«
- Senefelder«
- Nathaniel Currier«
- James Merritt Ives«
- James Ives«
- Ives«
- Honore Daumier«
- Daumier«
- Currier«
- Aloys Senefelder«
- Alois Senefelder«